The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2005

Filed:

May. 21, 2003
Applicants:

Kyu-hyun Lee, Kyungki-do, KR;

Tae-young Chung, Yongin, KR;

Chang-hyun Cho, Yongin, KR;

Yang-keun Park, Yongin, KR;

Sang-bum Kim, Suwon, KR;

Inventors:

Kyu-hyun Lee, Kyungki-do, KR;

Tae-young Chung, Yongin, KR;

Chang-hyun Cho, Yongin, KR;

Yang-keun Park, Yongin, KR;

Sang-bum Kim, Suwon, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/20 ; H01L021/8242 ; H01L029/94 ;
U.S. Cl.
CPC ...
Abstract

An integrated circuit memory device is formed by forming an interlevel insulating layer on a substrate. A plurality of storage node contact holes are formed in the interlayer insulating layer and are arranged in a pattern. A plurality of contact plugs are formed in the plurality of storage node contact holes, respectively. A material layer is formed on the interlevel insulating layer that has a plurality of landing pad holes that expose the plurality of contact plugs, respectively, the plurality of landing pad holes are arranged in a pattern that is offset with respect to the pattern of the storage node contact holes. A plurality of landing pads are formed in the plurality of landing pad holes and are connected to the plurality of contact plugs, respectively. A plurality of storage nodes are formed that are connected to the plurality of landing pads, respectively.


Find Patent Forward Citations

Lee, Kyu-hyun. (2005). Methods of forming integrated circuit memory devices that include a plurality of landing pad holes that are arranged in a staggered pattern and integrated circuit memory devices formed thereby (U.S. Patent No. 6890841). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6890841

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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