The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2005
Filed:
Jan. 27, 2004
Applicant:
Eran Rotem, Haifa, IL;
Inventor:
Eran Rotem, Haifa, IL;
Assignee:
Marvell Semiconductor Israel Ltd., Yokneam, IL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/44 ;
U.S. Cl.
CPC ...
Abstract
A method of forming a flip chip device comprises providing a semiconductor die having a core area and a periphery area. The periphery area includes an electrostatic discharge (ESD) structure. The semiconductor die including includes at least one power conductor. A substrate having a source of power is provided. A first connection circuit is located within the semiconductor die core area to couple power between the substrate and the semiconductor die power conductor. The ESD structure is electrically coupled to the first connection circuit. The first connection circuit is electrically coupled to the substrate via a conductive bump.