The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2005
Filed:
Apr. 17, 2003
Applicant:
Inderjit Singh, San Jose, CA (US);
Inventor:
Inderjit Singh, San Jose, CA (US);
Assignee:
Fairchild Semiconductor Corporation, South Portland, ME (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/283 ; H01L021/60 ; G01L021/58 ;
U.S. Cl.
CPC ...
Abstract
A method for producing a die package is disclosed. A bumped die comprises solder bumps mounted to a leadframe including a first lead comprising a first locating hole and a second lead comprising a second locating hole. The solder bumps are present in the first and second locating holes, and a molding material is formed around the die.