The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2005
Filed:
Dec. 13, 2001
Bradley Paul Barber, Chatham, NJ (US);
Larue Norman Dunkleberger, Kintnersville, PA (US);
Jason Paul Goodelle, Bethlehem, PA (US);
Thomas Herbert Shilling, Macungie, PA (US);
Bradley Paul Barber, Chatham, NJ (US);
LaRue Norman Dunkleberger, Kintnersville, PA (US);
Jason Paul Goodelle, Bethlehem, PA (US);
Thomas Herbert Shilling, Macungie, PA (US);
Agere Systems, Inc., Allentown, PA (US);
Abstract
In the method, a cap wafer surface is lithographically etched at time of fabrication, so that a raised ridge onto which bonding material is placed is formed near a perimeter of a desired cavity region. This is done in order to reduce the bonding area between the cap wafer and electronic device wafers, so as to provide a better defined standoff. In another aspect of the method, the cap wager surface is lithographically etched to form recesses or trenches near the perimeter of a cavity region, each recess being filled with a sealing material, and polished if necessary to be flush with the cap wafer surface. Thereafter, the cap wafer surface is etched so that the filled recesses become the raised ridges which are used to bond a cap wafer to an electronic device wafer.