The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2005
Filed:
Aug. 28, 1998
Michael P. O'reilly, Melbourne, FL (US);
Robert W. Boyd, Eidson, TN (US);
Michael P. O'Reilly, Melbourne, FL (US);
Robert W. Boyd, Eidson, TN (US);
Harris Corporation, Melbourne, FL (US);
Abstract
A document verification scheme embeds in or deposits on a substrate/document a random distribution of dielectric particles that effectively create a unique electronically detectable signature. The dielectric constant of the particles is sufficiently larger than that of the substrate/document, so as to exhibit molecular level electric dipole moments, which cause a detectable modification of an external electric field passing through the substrate. Electronic signature verification is effected by comparing the digitized output of an electric field modification sensor with a digital code that has been stored previously in the data base. As long as the substrate containing the dielectric particle signature has not been altered, its randomly distributed capacitance characteristic will remain unchanged, and the two digital signatures seen by the comparator will effectively match one another, verifying authentication of the substrate. However, alteration of the substrate and thereby the particle distribution will modify the capacitance characteristic associated with the randomly distributed particles and cause the comparator to be presented with two diverse digital signatures—indicating tampering.