The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2005
Filed:
May. 15, 2002
Takeshi Ishikawa, Nishikasugai-gun, JP;
Takashi Nagasaka, Anjo, JP;
Takeshi Ishikawa, Nishikasugai-gun, JP;
Takashi Nagasaka, Anjo, JP;
Denso Corporation, Kariya, JP;
Abstract
The adhesion between a protective layer, which covers a wiring layer, and a potting material, which covers a microchip, in a hybrid IC is improved without placing an additional material between the protective layer and the potting material. The potting material is separated from other electronic devices on the hybrid IC. To improve adhesion, the surface roughness of the protective layer is increased by adding insulating particles to the protective layer, striking the surface of the protective layer with ceramic particles, or replicating a mesh pattern of a screen mask on the surface of the protective layer. To keep the potting material separated from the other electronic devices, another potting material for covering the electronic devices, which is more viscous than the potting material for covering the microchip, is potted and hardened before the potting material for covering the microchip is potted.