The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2005
Filed:
Aug. 25, 2003
Paul Albert Kohl, Atlanta, GA (US);
Sue Ann Bidstrup Allen, Atlanta, GA (US);
Clifford Lee Henderson, Lilburn, GA (US);
Hollie Ann Reed, Smyrna, GA (US);
Dhananjay M. Bhusari, Kaiserslautern, DE;
Paul Albert Kohl, Atlanta, GA (US);
Sue Ann Bidstrup Allen, Atlanta, GA (US);
Clifford Lee Henderson, Lilburn, GA (US);
Hollie Ann Reed, Smyrna, GA (US);
Dhananjay M. Bhusari, Kaiserslautern, DE;
Georgia Tech Research Corporation, Atlanta, GA (US);
Abstract
A method of forming an air gap or gaps within solid structures and specifically semiconductor structures to reduce capacitive coupling between electrical elements such as metal lines, wherein a sacrificial material is used to occupy a closed interior volume in a semiconductor structure is disclosed. The sacrificial material is caused to decompose into one or more gaseous decomposition products which are removed, in one embodiment by diffusion, through an overcoat layer. The decomposition of the sacrificial material leaves an air gap or gaps at the closed interior volume previously occupied by the sacrificial material. The air gaps may be disposed between electrical leads to minimize capacitive coupling therebetween. Also disclosed are methods of forming multi-level air gaps and methods or forming over-coated conductive lines or leads wherein a portion of the overcoating is in contact with at least one air gap.