The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2005

Filed:

Mar. 01, 2002
Applicants:

Manfred Engelhardt, Feldkirchen-Westerham, DE;

Guenther Schindler, München, DE;

Inventors:

Manfred Engelhardt, Feldkirchen-Westerham, DE;

Guenther Schindler, München, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ;
U.S. Cl.
CPC ...
Abstract

An interconnect arrangement () has a first layer (), a first layer surface (), thereon at least two interconnects () having a second layer surface () essentially parallel to the first layer surface (), thereon a respective second layer () for each interconnect (), the second layers () of adjacent interconnects covering regions between the adjacent interconnects (), and thereon a third layer (), which completely closes off the regions between the adjacent interconnects () by means of coverage.


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Engelhardt, Manfred. (2005). Interconnect arrangement and method for fabricating an interconnect arrangement (U.S. Patent No. 6888244). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6888244

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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