The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2005
Filed:
Sep. 24, 2002
Masako Watanabe, Oita, JP;
Mutsumi Masumoto, Beppu, JP;
Masako Watanabe, Oita, JP;
Mutsumi Masumoto, Beppu, JP;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A semiconductor device and its manufacturing method with which the connection reliability can be improved without complicating the manufacturing process. Semiconductor chipis mounted on the principal surface of insulated substrate, and a conductive paste containing a heat-curing epoxy resin is supplied to via holesfrom the back of insulated substrate. Then, solder ballsare transferred onto the conductive paste of insulated substrate, and reflow soldering is applied in order to bond solder ballsto insulated substrate. During the reflow soldering, the heat-curing epoxy resin forms resin partsaround solder balls