The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2005
Filed:
Jul. 03, 2002
Kei Nakamura, Osaka, JP;
Satoshi Tanigawa, Osaka, JP;
Hiroshi Yamazaki, Osaka, JP;
Mineyoshi Hasegawa, Osaka, JP;
Kei Nakamura, Osaka, JP;
Satoshi Tanigawa, Osaka, JP;
Hiroshi Yamazaki, Osaka, JP;
Mineyoshi Hasegawa, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A multilayer flexible wired circuit board that can provide high density wiring and also can provide reduction in thickness and size, and a producing method thereof. A four-layered flexible wired circuit board is produced by preparing a double-sided substrate in which a first conductor layer and a second conductor layer are laminated on both sides of a first insulating layer; preparing a first single-sided substrate in which a third conductor layer is laminated on one surface of a second insulating layer and a second single-sided substrate in which a fourth conductor layer is laminated on one surface of a third insulating layer; bonding the first conductor layer and the third conductor layer to each other through a first thermosetting adhesive layer; and bonding the second conductor layer and the fourth conductor layer to each other through a second thermosetting adhesive layer.