The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2005

Filed:

Dec. 11, 2002
Applicants:

Johan Lamotte, Rotselaar, BE;

Frank Louwet, Diepenbeek, BE;

Tom Cloots, Londerzeel, BE;

Huub Van Aert, Pulderbos, BE;

Inventors:

Johan Lamotte, Rotselaar, BE;

Frank Louwet, Diepenbeek, BE;

Tom Cloots, Londerzeel, BE;

Huub Van Aert, Pulderbos, BE;

Assignee:

Agfa-Gevaert, Mortsel, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D06N007/04 ;
U.S. Cl.
CPC ...
Abstract

A material for making a conductive pattern, the material comprising a support and a heat-differentiable element, the heat-differentiable element comprising an outermost layer containing a polyanion and an intrinsically conductive polymer and optionally a second layer contiguous with the outermost layer, characterized in that the outermost layer and/or the optional second layer contains hydrophobic thermocoagulable latex particles in a weight ratio range with respect to the intrinsically conductive polymer in the range of 20:1 to 1:5, the hydrophobic thermocoagulable latex particles are capable upon heating of increasing the conductivity of the heated parts of the outermost layer relative to the unheated parts of the outermost layer and/or changing the removability of the heated parts of the outermost layer relative to the unheated parts of the outermost layer and the heat-differentiable element does not comprise a di- or polyhydroxy organic compound or an aprotic compound with a dielectric constant, ∈, ≧15; a method of making a conductive pattern on a support therewith; and a use of the material for making a conductive pattern in making an electronic circuit in the production of an electric or semiconductor device such as a printed circuit board, an integrated circuit, a display or touch screen, an electroluminescent device or a photovoltaic cell.


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