The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2005
Filed:
Aug. 09, 2002
Hisashi Wakako, Aichi, JP;
Masahiro Iba, Aichi, JP;
Kazuhisa Sato, Aichi, JP;
Kazuo Kimura, Aichi, JP;
Hisashi Wakako, Aichi, JP;
Masahiro Iba, Aichi, JP;
Kazuhisa Sato, Aichi, JP;
Kazuo Kimura, Aichi, JP;
NGK Spark Plug Co., Ltd., Aichi, JP;
Abstract
A method for fabricating a component board which includes forming a first main-face-side Au plating layer on surfaces of main-face-side connection terminals and a first back-face-side Au plating layer on surfaces of back-face-side connection terminals of the component board; covering the first main-face-side Au plating layer with a protection layer; forming a second back-face-side Au plating layer on the first back-face-side Au plating layer; and removing the protection layer after completing the second Au plating step. Alternatively, the first back-face-side Au plating layer may be removed after completing the masking step. Displacement Au plating is used as the first and second Au plating.