The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2005
Filed:
Dec. 20, 2002
Yifah Gavra, Los Altos, CA (US);
Amos Dor, Sunnyvale, CA (US);
Yifah Gavra, Los Altos, CA (US);
Amos Dor, Sunnyvale, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method () for determining a response to a wafer manufacturing process problem includes the steps of generating a wafer map signature () containing defect attributes to be identified and retrieving () one or more wafer map signatures from a database. The wafer map signature to be identified is matched () with the one or more wafer map signatures from the database in order to help find a root cause of a defect in a wafer manufacturing process. This provides at least the advantage that a signature matching capability allows an Operator to more accurately identify a root manufacturing cause of a wafer defect. Furthermore, instant feedback to the wafer manufacturing process can be provided to facilitate rapid correction of manufacturing errors.