The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2005
Filed:
Jul. 26, 2002
Takashi Ogino, Saitama, JP;
Hirotaka Murakami, Saitama, JP;
Takashi Ogino, Saitama, JP;
Hirotaka Murakami, Saitama, JP;
Honda Giken Kogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
In a method and an apparatus for thermal analysis, a target region is divided by dividing the geometry of the target object of the thermal analysis into a finite number of finite elements or cells. The thermal analysis on the target region is conducted using the results of the division. A temperature distribution on the target object is obtained from the heat transfer coefficients by a temperature distribution calculating unit. The actual temperatures at specific points are obtained based on temperature distribution obtained by the specific point temperature calculating unit. Differences between the actually obtained temperatures at the specific points and the predetermined target temperatures at the specific points are obtained by a difference calculating/determining unit. If the differences are determined to be out of the prescribed range, the heat transfer coefficients are changed by a heat transfer coefficient updating unit. These steps are repeated until the differences fall within the prescribed range so that temperature distribution on the target object is obtained. The method and apparatus for thermal analysis obtains temperature distribution universally, irrespective of geometries of the target object.