The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2005

Filed:

Mar. 03, 2003
Applicants:

Takashi Matsui, Nara, JP;

Motoji Shiota, Nara, JP;

Kiyoshi Inada, Joyo, JP;

Inventors:

Takashi Matsui, Nara, JP;

Motoji Shiota, Nara, JP;

Kiyoshi Inada, Joyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F001/13 ;
U.S. Cl.
CPC ...
Abstract

In the manufacturing step of performing thermal compression bonding with respect to a driving integrated circuit and a glass substrate included in a liquid crystal panel so as to connect an electrode of the driving integrated circuit and an electrode of the glass substrate by using an anisotropic conductive adhesive in which conductive particles are diffused in an insulative adhesive, the anisotropic conductive adhesive includes conductive particles, a resin a whose average molecular weight is in a range of from 10000 to 100000, a resin b whose average molecular weight is of not more than 1000, a stress relaxation resin, and a curing agent; and a Young's modulus of the anisotropic conductive adhesive after curing is in a range of from 1.4 Gpa to 1.6 Gpa.


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