The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2005
Filed:
Apr. 24, 2001
Applicants:
Kazuhiro Maeno, Aichi-ken, JP;
Eiji Kono, Aichi-ken, JP;
Inventors:
Kazuhiro Maeno, Aichi-ken, JP;
Eiji Kono, Aichi-ken, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/04 ; H05K005/02 ; H05K007/18 ;
U.S. Cl.
CPC ...
Abstract
A board-shaped thermal conductor base board () is arranged on the bottom surface of a power module (). Substrates () and () are arranged on the top surface of the thermal conductor base board (), and semiconductor elements () and () are respectively arranged on the top surfaces of the substrates () and (). The semiconductor elements () are surrounded by a resinous case (). A source electrode () is attached above and apart from the semiconductor elements () by using the resinous case (). The connection between the source electrode () and the sources of the semiconductor elements () are connected by wire bonding.