The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2005
Filed:
Mar. 31, 2001
Rainer Schoenfeld, Duesseldorf, DE;
Hubert Schenkel, Sandhausen, DE;
Harald Kuester, Duesseldorf, DE;
Rainer Schoenfeld, Duesseldorf, DE;
Hubert Schenkel, Sandhausen, DE;
Harald Kuester, Duesseldorf, DE;
Henkel Kommanditgesellschaft auf Aktien, Duesseldorf, DE;
Abstract
Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder component for epoxy resin compositions. The reaction products based on tricarboxylic anhydrides or tetracarboxylic anhydrides are distinguished by having on average more than one imide group and carboxyl group per molecule. The compositions may optionally also contain condensation products obtained from tri- or poly-functional polyols and/or tri- or poly-functional amino-terminated polymers and cyclic carboxylic anhydrides, wherein the latter reaction products contain on average more than one carboxyl group per molecule. These compositions additionally contain conventional rubber-modified epoxy resins together with liquid and/or solid polyepoxy resins and conventional hardeners and accelerators and optionally fillers and rheology auxiliaries. Such compositions are particularly suitable as impact-resistant, impact/peel-resistant and peel-resistant adhesives in vehicle construction and in electronics. Particularly at very low temperatures, these adhesives exhibit very good impact and peel properties combined with very good corrosion resistance and ageing resistance of the adhesive bond.