The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2005
Filed:
Jun. 29, 2001
Theary Chheang, Bloomington, MN (US);
Andrew M. Hine, St. Paul, MN (US);
Mark W. Muggli, West St. Paul, MN (US);
Susan C. Noe, St. Paul, MN (US);
Patricia M. Sanft, St. Paul Park, MN (US);
William J. Schultz, Vadnais Heights, MN (US);
Robert D. Taylor, Stacy, MN (US);
Stanley F. Tead, St. Paul, MN (US);
Theary Chheang, Bloomington, MN (US);
Andrew M. Hine, St. Paul, MN (US);
Mark W. Muggli, West St. Paul, MN (US);
Susan C. Noe, St. Paul, MN (US);
Patricia M. Sanft, St. Paul Park, MN (US);
William J. Schultz, Vadnais Heights, MN (US);
Robert D. Taylor, Stacy, MN (US);
Stanley F. Tead, St. Paul, MN (US);
3M Innovative Properties Company, St. Paul, MN (US);
Abstract
Incorporating organophilic clay into hot melt adhesive compositions, particularly those comprising semi-crystalline, thermoplastic polymers, greatly improves the adhesive properties in many respects. Some of these improvements are particularly beneficial to the specific use of hot melt adhesives filled with electrically conductive particles for use as electrically conductive adhesives.