The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2005
Filed:
Sep. 22, 2003
Motokazu Kobayashi, Kanagawa, JP;
Toshiya Yuasa, Kanagawa, JP;
Makoto Kubota, Kanagawa, JP;
Shinji Eritate, Kanagawa, JP;
Fumio Uchida, Osaka, JP;
Chiemi Shimizu, Osaka, JP;
Kenji Maeda, Gifu, JP;
Motokazu Kobayashi, Kanagawa, JP;
Toshiya Yuasa, Kanagawa, JP;
Makoto Kubota, Kanagawa, JP;
Shinji Eritate, Kanagawa, JP;
Fumio Uchida, Osaka, JP;
Chiemi Shimizu, Osaka, JP;
Kenji Maeda, Gifu, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Fuji Chemical Co. Ltd., Osaka, JP;
Abstract
The invention provides a method for manufacturing a piezoelectric element including a coating step of coating a substrate with a coating liquid for forming the piezoelectric element thereby forming a coated film, a drying step of drying the coated film, a preliminary sintering step of preliminarily sintering the coated film thereby forming an oxide film, a final sintering step of finally sintering the oxide film thereby forming a piezoelectric film, and a cooling step of cooling the piezoelectric film, wherein the steps are executed in the presence of a moisture-containing gas; in the coating step the substrate has a temperature equal to or less than 50° C. and the moisture-containing gas has a relative humidity of 60% RH or less at 25° C.; in the drying step, the substrate has a temperature equal to or less than 200° C. and the relative humidity is 10 to 70% RH; in the preliminary sintering step the substrate has a temperature of 200 to 450° C. and the relative humidity is 70 to 100% RH; in the final sintering step the substrate has a temperature of 500 to 800° C. and the relative humidity is 70 to 100% RH.