The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2005

Filed:

Aug. 31, 2001
Applicants:

Yoshihiro Ozaki, Chiba, JP;

Toshimitsu Nagaya, Chiba, JP;

Atsushi Miyazaki, Chiba, JP;

Susumu Satoh, Chiba, JP;

Mineo Muraki, Kurashiki, JP;

Setsuo Kakihara, Chiba, JP;

Toshihiro Kasamo, Chiba, JP;

Inventors:

Yoshihiro Ozaki, Chiba, JP;

Toshimitsu Nagaya, Chiba, JP;

Atsushi Miyazaki, Chiba, JP;

Susumu Satoh, Chiba, JP;

Mineo Muraki, Kurashiki, JP;

Setsuo Kakihara, Chiba, JP;

Toshihiro Kasamo, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C038/24 ; C22C038/26 ; C22C038/28 ; C21D008/02 ;
U.S. Cl.
CPC ...
Abstract

A martensitic stainless steel sheet which is hard to be softened by tempering caused by heating during the use of a disk brake, can maintain the predetermined hardness, and has excellent punching workability, bending workability before quenching, and a particularly small shear drop, and in which a predetermined hardness after quenching is constantly achieved, in a low carbon martensitic stainless steel sheet used only after quenching. Specifically, the sheet contains, on the basis of mass percent, 0.030% to 0.100% C; 0.50% or less of Si; 1.00% to 2.50% Mn; more than 10.00% to 15.00% Cr; at least one selected from the group consisting of 0.01% to 0.50% Ti, 0.01% to 0.50% V, 0.01% to 1.00% Nb, and 0.01% to 1.00% Zr; N in an amount defined by the following expression, N: 0.005% to (Ti+V)×14/50+(Nb+Zr)×14/90; and the balance being Fe and incidental impurities.


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