The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2005
Filed:
Nov. 26, 2003
Hironobu Amano, Toyokawa, JP;
Yasuo Moribe, Toyokawa, JP;
Hiroshi Umeda, Toyokawa, JP;
Mitsuyuki Matsushita, Toyokawa, JP;
Hironobu Amano, Toyokawa, JP;
Yasuo Moribe, Toyokawa, JP;
Hiroshi Umeda, Toyokawa, JP;
Mitsuyuki Matsushita, Toyokawa, JP;
Sintokogio, Ltd., Aichi-ken, JP;
Abstract
To provide a monitoring system for remotely monitoring the operation of a molding apparatus or an air-flow and press molding apparatus. The monitoring systems for monitoring a molding apparatus and an airflow and press molding apparatus include sensors, a local unit, and a remote unit. The local unit transmits the signals associated with the required attributes, which are measured by the sensors, of the molding apparatus to the remote unit via the communication network. The remote unit is designed so that it receives the signals transmitted from the local unit; thereby the user can monitor the molding apparatus or the air-flow and press molding apparatus remotely at the production and operation by them.