The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2005
Filed:
Apr. 25, 2002
Jeffrey L. Deeney, Fort Collins, CO (US);
Joseph D. Dutson, Loveland, CO (US);
Glenn C. Simon, Auburn, CA (US);
Jeffrey L. Deeney, Fort Collins, CO (US);
Joseph D. Dutson, Loveland, CO (US);
Glenn C. Simon, Auburn, CA (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
A wrap-around cooling arrangement for a printed circuit board is disclosed. Such an arrangement comprises: a printed circuit board ('PCB') having a first side and a second side opposite to said first side; a heat sink arranged on said first side of said PCB; a first to-be-cooled component coupled to said second side of said PCB; and a thermal jumper to thermally couple said first component on said second side to said heat sink on said first side, said jumper being configured to extend physically around a side edge of said PCB.