The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6882044 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 19, 2005

Filed:

May. 17, 2002
Applicants:

Brian E. Lemoff, Union City, CA (US);

Lisa A. Buckman, San Francisco, CA (US);

Inventors:

Brian E. Lemoff, Union City, CA (US);

Lisa A. Buckman, San Francisco, CA (US);

Assignee:

Agilent Technologies, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/34 ;
U.S. Cl.
CPC ...
Abstract

Conductors to interconnect electronic devices, the conductors being formed on a detachable substrate. The substrate is aligned with a package containing electronic devices. The conductors are bonded to pads on the devices. Then, the substrate is detached. Each conductor is self supporting between the devices, has a two dimensional shape and has a surface that is substantially parallel to a surface of the pads.


Find Patent Forward Citations

Lemoff, Brian. (2005). High speed electronic interconnection using a detachable substrate (U.S. Patent No. 6882044). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6882044

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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