The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2005
Filed:
Aug. 06, 2002
Applicant:
Hideo Miyasaka, Sakata, JP;
Inventor:
Hideo Miyasaka, Sakata, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/44 ;
U.S. Cl.
CPC ...
Abstract
A conductive member is provided on each of electrodes of a semiconductor element. The conductive member is pressed into a shape having a height of approximately two-thirds of the original height to provide a bump. The semiconductor element is caused to face a substrate having an interconnecting pattern with an interposed adhesive containing an insulating filler. At least one of the semiconductor element and the substrate is pressed to electrically connect the bumps to the interconnecting pattern.
Miyasaka, Hideo. (2005). Method of bonding a semiconductor element to a substrate (U.S. Patent No. 6881612). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6881612
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile