The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2005
Filed:
Apr. 07, 2003
Hitoshi Amita, Chiba, JP;
Takashi Shoji, Chiba, JP;
Shunsuke Nagasaki, Chiba, JP;
Yoshinori Shibuya, Chiba, JP;
Isamu Taguchi, Chiba, JP;
Noriko Murase, Chiba, JP;
Hitoshi Amita, Chiba, JP;
Takashi Shoji, Chiba, JP;
Shunsuke Nagasaki, Chiba, JP;
Yoshinori Shibuya, Chiba, JP;
Isamu Taguchi, Chiba, JP;
Noriko Murase, Chiba, JP;
Showa Denko K.K., Tokyo, JP;
Abstract
A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 μm or less is 30% or less, wherein the oxygen content is 500 ppm or less. A flux for solder paste comprises an organic acid component consisting of an organic acid ester and an ester decomposer catalyst, an organic halogen compound, a reducing agent and a resin component. A solder paste mainly comprises a flux and a solder powder, wherein the water content of the solder paste is 0.5% by weight or less.