The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2005
Filed:
May. 02, 2002
Heinrich Heilbronner, Stein, DE;
Heinrich Heilbronner, Stein, DE;
Semikron Elektronik GmbH, Nuremberg, DE;
Abstract
A power semiconductor module consists of a ceramic substrate with electrically conductive contact surfaces arranged thereon in a 'circuit-friendly' manner. Components arranged on the substrate in a 'circuit-friendly' manner. A pressure contact means, consisting of a flexible pressure accumulator, and a pressure plate produce pressure for resilient bonding of power and control connections. To increase performance, reliability and service life while reducing manufacturing costs, different configuration methods for the individual components are absolutely essential. This is achieved by a flexible circuit board which connects components with each other in a circuit-friendly manner and/or with the contact surfaces of the substrate, whereby a flexible insulation material is provided to insulate components from each other.