The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2005

Filed:

Jul. 08, 2004
Applicants:

Hsiang-chieh Tseng, Banciao, TW;

Yi-song Liu, Taipei, TW;

Chia-min Chou, Sanchong, TW;

Chia-feng Yeh, Banciao, TW;

Inventors:

Hsiang-Chieh Tseng, Banciao, TW;

Yi-Song Liu, Taipei, TW;

Chia-Min Chou, Sanchong, TW;

Chia-Feng Yeh, Banciao, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B021/02 ;
U.S. Cl.
CPC ...
Abstract

The present invention provides a thermoelectric cooling apparatus for cooling an electronic device such as a CPU, or a computer chip. The apparatus cools the electronic device by two stages. In the first stage, a heat absorbing block collects the heat produced by the electronic device and the apparatus pre-cools the electronic device by dissipating a portion of the collected heat in a distant location through a front heat conductive device and a front radiator. Thereby the heat of the electronic device is reduced to a degree that a TEC can efficiently handle. In the second stage, a TEC of the apparatus dissipate the residual of the heat produced by the electronic device through at least a back heat pipe and a back radiator.


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