The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2005
Filed:
Nov. 25, 2002
Eriko Takeda, Tokyo, JP;
Atsushi Isobe, Kodaira, JP;
Satoshi Tanaka, Kokubunji, JP;
Hiroshi Okabe, Kokubunji, JP;
Eriko Takeda, Tokyo, JP;
Atsushi Isobe, Kodaira, JP;
Satoshi Tanaka, Kokubunji, JP;
Hiroshi Okabe, Kokubunji, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the firs chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.