The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2005
Filed:
Jan. 10, 2003
Applicants:
Hideki Fukumoto, Nagoya, JP;
Takanobu Koshimizu, Nagoya, JP;
Makoto Kataoka, Nagoya, JP;
Yoshihisa Saimoto, Nagoya, JP;
Inventors:
Hideki Fukumoto, Nagoya, JP;
Takanobu Koshimizu, Nagoya, JP;
Makoto Kataoka, Nagoya, JP;
Yoshihisa Saimoto, Nagoya, JP;
Assignee:
Mitsui Chemicals, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/58 ;
U.S. Cl.
CPC ...
Abstract
An adhesive film for protecting the surface of a semiconductor wafer wherein the adhesive layer is formed on one surface of a substrate film, the substrate film comprising at least one layer which satisfies the following requisites (A) and at least one of (B) or (C):
Fukumoto, Hideki. (2005). Surface protecting adhesive film for semiconductor wafer and processing method for semiconductor wafer using said adhesive film (U.S. Patent No. 6879026). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6879026
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile