The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2005
Filed:
Apr. 10, 2001
Zhongning Liang, Nijmegen, NL;
Erik Jan Lous, Nijmegen, NL;
Zhongning Liang, Nijmegen, NL;
Erik Jan Lous, Nijmegen, NL;
Koninklijke Philips Electronics N.V., Eindhoven, NL;
Abstract
The invention relates to a semiconductor device comprising bond pad structure, which bond pad structure comprises a bond pad disposed above at least one layered stricture, but preferably a stack of layered structures, wherein the layered structure comprises a metal layer and a layer of a dielectric material. In the layer of dielectric material via lines are present and arranged in such a way that the metal layers and the via lines form isolated areas filled with the dielectric material.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile