The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2005
Filed:
Dec. 30, 2003
Lewis B. Aronson, Los Altos, CA (US);
Giorgio Giaretta, Mountain View, CA (US);
Stefano Schiaffino, Menlo Park, CA (US);
Dev E. Kumar, San Jose, CA (US);
T. G. Beck Mason, San Jose, CA (US);
Lewis B. Aronson, Los Altos, CA (US);
Giorgio Giaretta, Mountain View, CA (US);
Stefano Schiaffino, Menlo Park, CA (US);
Dev E. Kumar, San Jose, CA (US);
T. G. Beck Mason, San Jose, CA (US);
Finisar Corporation, Sunnyvale, CA (US);
Abstract
A small form factor transceiver module that incorporates an externally modulated laser (EML). The transceiver module has a transmitter optical subassembly with a header assembly having a base with a platform extending through. The platform has a plurality of conductive traces extending through the platform for making connections on both sides of the base. A thermoelectric cooler (TEC) is used to dissipate heat from a laser within the header assembly. The TEC dissipates heat sufficiently to allow the EML to be used in the header assembly. In this manner, EMLs can be used in relatively small optical devices, including small form factor transceivers that comply with the XFP standard. The XFP modules with EMLs can be used for longer links than XFPs without EMLs. In addition, EMLs can be stabilized using TECs so that XFP modules can be used for DWDM-type applications.