The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2005
Filed:
Sep. 25, 2001
Applicants:
Toshiaki Ishii, Hitachi, JP;
Hiroyoshi Kokaku, Hitachi, JP;
Akira Nagai, Hitachi, JP;
Takao Miwa, Hitachinaka, JP;
Inventors:
Toshiaki Ishii, Hitachi, JP;
Hiroyoshi Kokaku, Hitachi, JP;
Akira Nagai, Hitachi, JP;
Takao Miwa, Hitachinaka, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B027/38 ; H01L021/56 ; C08L063/00 ;
U.S. Cl.
CPC ...
Abstract
The present invention provides a biphenyl based epoxy resin comprising a curing agent and an inorganic filler containing an alkali alkaline earth metal oxide wherein the epoxy resin has a variation rate of hardness at 25° C. and a relative humidity of 50% for 72 hours of less than 10% and a variation rate of flow at 25° C. and a relative humidity of 20% or below for 72 hours of less than 20%.