The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2005
Filed:
Jul. 12, 2002
Kyung Wook Paik, Daejeon, KR;
Myung Jin Yim, Daejeon, KR;
Kyung wook Paik, Daejeon, KR;
Myung jin Yim, Daejeon, KR;
Korea Advanced Institute of Science and Technology, Daejeon, KR;
Abstract
Disclosed is a triple layered ACA film adapted for enhancing the adhesion strength of a typical single layer Anisotropic Conductive Film or for enhancing the adhesion strength of the ACA film in flip chip bonding. The triple layered ACA film of the invention comprises: a main ACA film based upon epoxy resin and containing conductive particles having a particle size of 3 to 10 μm and optionally non-conductive particles having a particle size of 0.1 to 1 μm; and adhesion reinforcing layers based upon epoxy resin and formed at both sides of the main ACA film.