The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2005
Filed:
Jun. 09, 2003
Che-hung Huang, Jungli, TW;
Steven Hsu, Taoyuan, TW;
Che-Hung Huang, Jungli, TW;
Steven Hsu, Taoyuan, TW;
High Tech Computer, Corp., Tao Yuan, TW;
Abstract
A process for forming an interface () between a plated and a non-plated area () on the surface of a plastic component () is disclosed. First, an anti-plating layer () is formed over the surface of the plastic component. Thereafter, a low-power laser beam () is used to remove a portion of the anti-plating layer and to form an interface between the plated area and the non-plated area. A seeding layer () is formed on the plated area so that the plated area is electrically conductive. Finally, a metallic layer () is electrically plated over the seeding layer. The metallic layer connects with the anti-plating layer via the interface. The cost of producing the anti-plating layer is low. Moreover, since the laser etching operation is able to produce a high-quality interface boundary between the plated and the non-plated area, yield of the process is improved.