The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2005

Filed:

Mar. 19, 2002
Applicants:

Syouzou Kasai, Hitachinaka, JP;

Yoshiyuki Okishima, Higashiibaraki, JP;

Tomonari Morioka, Hitachinaka, JP;

Yasushi Shimizu, Hitachinaka, JP;

Hiroyuki Tanaka, Hitachinaka, JP;

Takayasu Furukawa, Hitachinaka, JP;

Noriyuki Shimoda, Higashimurayama, JP;

Seiichi Ugai, Hitachinaka, JP;

Inventors:

Syouzou Kasai, Hitachinaka, JP;

Yoshiyuki Okishima, Higashiibaraki, JP;

Tomonari Morioka, Hitachinaka, JP;

Yasushi Shimizu, Hitachinaka, JP;

Hiroyuki Tanaka, Hitachinaka, JP;

Takayasu Furukawa, Hitachinaka, JP;

Noriyuki Shimoda, Higashimurayama, JP;

Seiichi Ugai, Hitachinaka, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N027/453 ;
U.S. Cl.
CPC ...
Abstract

The present invention easies a connection between electrodes of a capillary array device and a connection plate for supplying a high voltage to the electrodes. According to the present invention, a connection plateand hollow electrodesare connected without solder but via a spring force. Alternatively, the hollow electrodescan be connected to the connection plateby utilizing volume elasticity of the connection plate.


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