Shielded microelectronic connector assembly and method of manufacturing

Abstract

An advanced multi-connector electronic assembly incorporating a variety of different noise shield elements which reduce noise interference and increase performance. In one embodiment, the connector assembly comprises a plurality of connectors with associated electronic components arranged in two parallel rows, one disposed atop the other such that modular plug recesses of all connectors are accessible by the user. The assembly utilizes a substrate shield which mitigates noise transmission through the bottom surface of the assembly, as well as an external 'wrap-around shield to mitigate noise transmission through the remaining external surfaces. In a second embodiment, the connector assembly further includes a top-to-bottom shield interposed between the top and bottom rows of connectors to reduce noise transmission between the rows of connectors, and a plurality of front-to-back shield elements disposed between the electronic components of respective top and bottom row connectors to limit transmission between the electronic components. A method of manufacturing the aforementioned assembly is also disclosed.