The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2005

Filed:

Jul. 23, 2002
Applicants:

Morris P. F. Liang, Hsinchu Hsien, TW;

Sway Chuang, Hsinchu Hsien, TW;

Frank K. C. Fan, Hsinchu, TW;

Chen Chung Kao, Hsinchu Hsien, TW;

Inventors:

Morris P. F. Liang, Hsinchu Hsien, TW;

Sway Chuang, Hsinchu Hsien, TW;

Frank K. C. Fan, Hsinchu, TW;

Chen Chung Kao, Hsinchu Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F027/02 ;
U.S. Cl.
CPC ...
Abstract

A high density multi-layer microcoil includes a substrate, a multi-layer coil winding, a magnetic core and a dry film photoresist structure. The multi-layer coil winding and the magnetic core are supported by the dry film photoresist structure. The fabrication process is using photolithography process to form a dry film photoresist structure with a coil tunnel having coil elements perpendicular to the substrate and two outlets at ends of the tunnel; and injecting a conductive material with a low melting point into the tunnel and forming the coil winding.


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