The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2005
Filed:
Oct. 25, 2002
Applicant:
Jimmy Hsu, Taipei Hsien, TW;
Inventor:
Jimmy Hsu, Taipei Hsien, TW;
Assignee:
VIA Technologies, Inc., Taipei Hsien, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/48 ;
U.S. Cl.
CPC ...
Abstract
A chip package structure with a guard circuit design. The individual wires of two pairs of ground wires are positioned on each side of a high frequency signal wire so that external interference is minimized during transmission, multiple ground contacts are provided and current routes are shortened. In the meantime, strength of the electromagnetic field produced by the high frequency signal wire during transmission is limited within the pairs of ground wires. Ultimately, the range of interference by the electromagnetic field, the insertion loss and the return loss are all reduced resulting in improved performance of the chip package.