The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2005
Filed:
Mar. 26, 2003
Taiga Arai, Hitachi, JP;
Fujiaki Nose, Ome, JP;
Hiroshi Kikuchi, Hidaka, JP;
Yoichi Tamaki, Kokubunji, JP;
Taiga Arai, Hitachi, JP;
Fujiaki Nose, Ome, JP;
Hiroshi Kikuchi, Hidaka, JP;
Yoichi Tamaki, Kokubunji, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor device improved in reliability is disclosed. The semiconductor device comprises a semiconductor chip, a sealing member which seals the semiconductor chip with resin, a tub having a chip bonding surface for bonding with the chip and a back surface located on the side opposite to the chip bonding surface and exposed to a surface of the sealing member, plural inner leads electrically connected respectively to bonding pads on the semiconductor chip through wires such as gold wires, and plural outer leads integrally connected respectively to the inner leads and projecting to the exterior of the sealing member, wherein surfaces of the tub and the plural inner and outer leads are all coated with palladium plating. In the case where a heat radiation member is attached to the back surface of the tub, the palladium plating does not melt during solder reflow for example, so that the heat radiation member can be prevented from falling off and hence it is possible to improve the reliability of a QFP as the semiconductor device.