The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2005
Filed:
Apr. 18, 2002
Hendrikus Tilmans, Maastricht, NL;
Eric Beyne, Leuven, BE;
Henri Jansen, Leuven, BE;
Walter DE Raedt, Edegem, BE;
Hendrikus Tilmans, Maastricht, NL;
Eric Beyne, Leuven, BE;
Henri Jansen, Leuven, BE;
Walter De Raedt, Edegem, BE;
Interuniversitair Microelektronica Centrum (IMEC), Leuven, BE;
Abstract
An interconnect module and a method of manufacturing the same is described comprising: a substrate, an interconnect section formed on the substrate, and a variable passive device section formed on the substrate located laterally adjacent to the interconnect section. The interconnect section has at least two metal interconnect layers separated by a dielectric layer and the variable passive device has at least one moveable element. The moveable element is formed from a metal layer which is formed from the same material and at the same time as one of the two interconnect layers. The moveable element is formed on the dielectric layer and is released by local removal of the dielectric layer. Additional interconnect layers and intermediate dielectric layers may be added.