The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2005
Filed:
Jul. 31, 2003
Jerome C. Bhat, San Francisco, CA (US);
Cresente S. Elpedes, San Jose, CA (US);
Paul S. Martin, Pleasanton, CA (US);
Serge L. Rudaz, Sunnyvale, CA (US);
Jerome C. Bhat, San Francisco, CA (US);
Cresente S. Elpedes, San Jose, CA (US);
Paul S. Martin, Pleasanton, CA (US);
Serge L. Rudaz, Sunnyvale, CA (US);
Lumileds Lighting U.S., LLC, San Jose, CA (US);
Abstract
A device includes a submount, and a semiconductor light emitting device mounted on first and second conductive regions on a first side of the submount in a flip chip architecture configuration. The submount has third and fourth conductive regions on a second side of the submount. The third and fourth conductive regions may be used to solder the submount to structure such as a board, without the use of wire bonds. The first and third conductive regions are electrically connected by a first conductive layer and the second and fourth conductive regions are electrically connected by a second conductive layer. The first and second conductive layers may be disposed on the outside of the submount or within the submount.