The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2005

Filed:

Dec. 28, 2000
Applicants:

Olivier Demolliens, St Egreve, FR;

Pascale Berruyer, Vauhnaveys, FR;

Yorick Trouiller, Grenoble, FR;

Yves Morand, Grenoble, FR;

Inventors:

Olivier Demolliens, St Egreve, FR;

Pascale Berruyer, Vauhnaveys, FR;

Yorick Trouiller, Grenoble, FR;

Yves Morand, Grenoble, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/4762 ; H01L021/3205 ;
U.S. Cl.
CPC ...
Abstract

The invention concerns a method for fabricating a damascene type structure of interconnections on a semiconductor device. It includes the following steps:


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Demolliens, Olivier. (2005). Method for fabricating a structure of interconnections comprising an electric insulation including air or vacuum gaps (U.S. Patent No. 6875686). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6875686

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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