The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2005
Filed:
Mar. 29, 2004
Man Hon Cheng, Tsuen Wan, HK;
Wai Wong Chow, Sheung Shue, HK;
Wai Keung Ho, Tsz Wan Shan, HK;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A semiconductor deviceincludes a base carrier, an adhesive material layerand an integrated circuit die. The base carrierhas a top side and a bottom side, the top side having a central area for receiving the dieand a peripheral area surrounding the central area. The adhesive material layeris disposed on the top side of the base carrier in an 'X' shaped pattern. The 'X' shaped pattern includes two bisecting lines. The two bisecting lines extend well beyond the central area and into the peripheral area of the base carrier top surface. The dieis attached to the base carrierwith the adhesive material layerat the central area. Even after attachment of the die, the adhesive materialextends well beyond the dieand the central area into the peripheral area.