The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2005
Filed:
Aug. 01, 2000
Naochika Kogure, Utsunomiya, JP;
Hiroyuki Gokuraku, Imaichi, JP;
Seiji Takahashi, Utsunomiya, JP;
Daisuke Imanari, Utsunomiya, JP;
Takashi Kitahama, Utsunomiya, JP;
Naochika Kogure, Utsunomiya, JP;
Hiroyuki Gokuraku, Imaichi, JP;
Seiji Takahashi, Utsunomiya, JP;
Daisuke Imanari, Utsunomiya, JP;
Takashi Kitahama, Utsunomiya, JP;
JSP Corporation, Tokyo, JP;
Abstract
A multi-layer expansion-molded article of a polypropylene resin, which is obtained by molding a multi-layer parison comprising a foamed resin layer and a resin layer provided on the outer side of the foamed resin layer in a mold in such manner that at least part of the opposed inner surfaces of foamed resin layer in the parison are fusion-bonded to each other, and has a polypropylene resin layer on the surface of a foamed polypropylene resin layer, wherein a melt tension, MT(gf) and a melt flow rate, MFR(g/10 min) obtained by measurement to a polypropylene resin forming the foamed resin layer in the expansion-molded article satisfy the relationship [log MT>−0.74 log MFR+0.66], and a melt tension, MT(gf) and a melt flow rate, MFR(g/10 min) obtained by measurement to a polypropylene resin forming the resin layer on the surface of the foamed resin layer satisfy the relationship [log MT>−1.02 log MFR+0.47].