The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2005
Filed:
Sep. 06, 2002
David W. Whitney, Santa Rosa, CA (US);
David W. Whitney, Santa Rosa, CA (US);
Abstract
An improved molding apparatus and method includes an adjustable mold component and a fixed mold component for molding precision articles; a bias force mechanism for applying a bias force to the adjustable mold component; and an adjustable mold component fine position adjustment mechanism operable exteriorly of the mold for applying a position adjustment force to the adjustable mold component to overcome the bias force and thereby adjust position of the adjustable mold component relative to a fixed mold component to reduce positional offset in a range of ±ten microns, or less, in at least one adjustment dimension. In one aspect, a plurality of bias force mechanisms and adjustment mechanisms provide positional adjustment in a plurality of adjustment dimensions. In another aspect, a feedback control loop responsive to optically sensed positional error automatically reduces positional offset.