The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2005
Filed:
Nov. 13, 2002
Applicants:
Xm Wong, Dongguan, CN;
Rock Tao, Dongguan, CN;
Assignee:
SAE Magnetics (H.K.) Ltd., Kwai Chung, HK;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K035/12 ; G11B005/60 ; G11B021/08 ;
U.S. Cl.
CPC ...
Abstract
A new type of suspension circuit electrical bonding pad for electrically and mechanically connecting the magnetic recording head is described. The new type of bonding pad will serve as the joint material as well as the joint interface. Thus, there is no need to apply the conductive material in between the bonding pads and the magnetic recording head terminals, consequently reducing the process leading time and simplifying the magnetic recording head assembly process.
Wong, Xm. (2005). Bonding pad of suspension circuit (U.S. Patent No. 6874677). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6874677
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile