The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2005

Filed:

Apr. 04, 2003
Applicants:

Madoka Nishiyama, Kanagawa, JP;

Seiji Morita, Kanagawa, JP;

Inventors:

Madoka Nishiyama, Kanagawa, JP;

Seiji Morita, Kanagawa, JP;

Assignee:

Nikon Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03C005/00 ;
U.S. Cl.
CPC ...
Abstract

A substrate having a photoresist coated thereon is exposed to exposure light along a line through a lens. The exposure position is moved from the initial position Oto a position Othat is separated from the initial position by a distance corresponding to the sum of a groove width Gw and a land width Lw. The exposure is carried out along a line parallel to the initial exposure line. By repeating this, exposed areas having a width Lw and a separation Gw are formed on the photoresist. The photoresist is developed to remove the exposed areas of the photoresist. A resin or the like is pressed on it to form a replica. From the replica, a stamper is manufactured using an electroforming method. Finally, a grooved molding substrate is manufactured from a glass or resin using the stamper. Although the land width Lw is defined by the effective spot diameter φ of the optical system, the groove width Gw can be less than this value.


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Nishiyama, Madoka. (2005). Method for manufacturing master substrate used for manufacturing grooved molding substrate, method for manufacturing stamper for manufacturing grooved molding substrate, method for manufacturing grooved molding substrate, grooved molding substrate, memory medium, memory device, and computer (U.S. Patent No. 6874262). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6874262

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