The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2005

Filed:

Sep. 07, 2000
Applicants:

Cheng Ping Wei, Gilbert, AZ (US);

Edwin D. Dair, Los Angeles, CA (US);

Inventors:

Cheng Ping Wei, Gilbert, AZ (US);

Edwin D. Dair, Los Angeles, CA (US);

Assignee:

JDS Uniphase Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04B010/00 ;
U.S. Cl.
CPC ...
Abstract

A fiber optic module for transferring data as pulses of light has an optical element with a first light transducer having a straddle mount lead and a second light transducer having a formed or bent signal lead. A first fiber optic receptacle optically couples to the first light transducer and a second fiber optic receptacle optically couples to a second light. A printed circuit board subassembly includes first and second printed circuit boards with an interconnection therebetween to couple to an electrical connector on the first. The first printed circuit board and second printed circuit boards are aligned so that the straddle mount leads couple to contacts on the first and the formed signal lead couple to contacts on the second. One or more electrical components in the fiber optic module process data for communication using light or photons over one or more optical fibers. An outer housing encloses the optical element subassembly and the printed circuit board subassembly. The electrical connector couples external electrical signals to the electrical components.


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