The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2005

Filed:

Sep. 07, 2001
Applicants:

Timothy E. Beerling, Berkeley, CA (US);

Michael J. Daneman, Pacifica, CA (US);

Inventors:

Timothy E. Beerling, Berkeley, CA (US);

Michael J. Daneman, Pacifica, CA (US);

Assignee:

Analog Devices, Inc., Norwood, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B006/26 ;
U.S. Cl.
CPC ...
Abstract

An optical microelectromechanical system (MEMS) device and a method for making it are disclosed. The device generally includes a substrate with two or more device dies attached to the substrate. Each device die includes one or more MEMS optical elements. A common clamping die is attached to the device dies such that each MEMS optical element aligns with a corresponding clamping surface on the common clamping die. The single larger clamping die, which covers all the elements on the smaller device dies, forces mirrors contained thereon to register accurately, in the 'ON' state. Such a device may be made by attaching two or more device dies to a substrate, and attaching a common clamping die to the two or more device dies. The device dies may be attached to the substrate before attaching the common clamping die to the device dies. Alternatively, the common clamping die may be attached to the device dies before the device dies are attached to the substrate. High yields may be achieved since simple semiconductor process may be used to fabricate the larger clamping die.


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