The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2005

Filed:

Apr. 02, 2001
Applicants:

Kazufumi Ishii, Tokyo, JP;

Shinichi Iura, Tokyo, JP;

Inventors:

Kazufumi Ishii, Tokyo, JP;

Shinichi Iura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L025/04 ; H01L025/07 ; H01L025/18 ; H01L025/74 ;
U.S. Cl.
CPC ...
Abstract

Power semiconductor devices, and particularly a power semiconductor device which contains a plurality of power semiconductor elements. The power semiconductor device capable of reducing differences in impedance caused by differences in length among wire interconnections, facilitating the electric connection between main circuit terminals and the outside, and lightening restrictions on the number and layout of the power semiconductor elements installed. In the power semiconductor device, a rectangular-loop-shaped interconnection board is disposed above a bottom substrate to cover an area above edges of the bottom substrate, with an opening above the center part of the bottom substrate. A main collector electrode terminal and a main emitter electrode terminal pass through the opening to protrude from an opening of a resin case so that they can be electrically connected to the outside. Control emitter pads and gate pads are electrically connected to the control emitter electrodes and the gate terminals through wire interconnections of equal length.


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